Electronic component placing apparatus and mounted board-producing apparatus

ABSTRACT

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL of 4L as a length with which each of two boards corresponding to a plurality of head units can be positioned at each component placement position and a board retreat position corresponding to each placement position can be secured and SL as a space for positioning a board stop mechanism at each placement position and each board retreat position, which is not less than 450 mm and not more than 1000 mm.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to an electronic component placingapparatus for placing electronic components on a board and amounted-board producing apparatus.

[0002] Conventionally, when electronic components are mounted on a boardsuch as a printed board, processes of printing a cream-like solder pasteon the board, placing the electronic components on the printed solderpaste, and heating and cooling the board on which the electroniccomponents are placed to solidify the solder so that the electroniccomponents are fixed on the board are performed.

[0003]FIG. 12 is a perspective view showing a configuration of anelectronic component placing system 9 for placing electronic componentson a board in a conventional mounting system for mounting electroniccomponents on a board. In the electronic component placing system 9, aboard on which solder pastes are printed is carried in from a printerfrom a direction shown with an arrow 901, and the board is carried alonga carrying path 902 in the electronic component placing system 9.Various electronic components are placed on the board while the board iscarried, and the board is carried out in a direction shown with an arrow903. Then, the board is carried into a reflow apparatus, and theelectronic components are fixed on the board.

[0004] In the electronic component placing system 9 shown in FIG. 12,three high-speed placing apparatuses 91 and two multifunctional placingapparatuses 92 are successively disposed, and an inspection apparatus 93for inspecting electronic components-placed states is disposed betweenthe high-speed placing apparatus 91 and the multifunctional placingapparatus 92. The high-speed placing apparatus 91 is an apparatus forplacing a large number of micro electronic components at high-speed on aboard, and the multifunctional placing apparatus 92 is an apparatus forplacing many types of electronic components on a board.

[0005] Meanwhile, the electronic component placing system 9 shown inFIG. 12 is designed such that electronic components can also be placedon a large-size board. On the other hand, as a portable terminalincluding a cellular phone is widely used, miniaturization of a boardincorporated in the portable terminal is also being progressed.

[0006] Thus, in order to efficiently place electronic components on aboard for a portable terminal by using the electronic component placingsystem 9, circuits for a multiplicity of portable terminals need to beformed on one board that is carried. However, with diversification ofportable terminals, production (mounting) of many types of boards in asmall number is more strongly required, and hence the configuration ofthe electronic component placing system 9 shown in FIG. 12 is becomingunsuitable to placement of electronic components on a board for aportable terminal.

[0007] Accordingly, an object of the present invention is to provide anelectronic component placing apparatus and a mounted-board producingapparatus suitable to production of a small-size board in considerationto the aforementioned issue.

SUMMARY OF THE INVENTION

[0008] In order to achieve the above object, the present invention hasthe following constitution.

[0009] According to a first aspect of the present invention, there isprovided an electronic component placing apparatus for placingelectronic components on a board having a length L along a boardcarrying direction, the electronic component placing apparatuscomprising:

[0010] an electronic component feeding unit for feeding the electroniccomponents;

[0011] a carrying unit that can carry the board in the carryingdirection from a board retreat position to a component placementposition, further from the component placement position to an outside ofthe component placement position;

[0012] a plurality of head units for holding the components from theelectronic component feeding unit and then placing the held componentson a plurality of boards; and

[0013] a drive unit for moving the plurality of head units between theelectronic component feeding unit and the boards,

[0014] wherein a substantial apparatus width along the board carryingdirection is a total dimension 4L+SL of 4L as a length with which eachof two boards corresponding to the plurality of head units can bepositioned at each component placement position and a board retreatposition corresponding to each placement position can be secured and SLas a space for positioning a board stop mechanism at each placementposition and each board retreat position, which is between 450 mm and1000 mm inclusive.

[0015] According to a second aspect of the present invention, there isprovided the electronic component placing apparatus according to thefirst aspect, wherein the substantial apparatus width is not less than540 mm and not more than 660 mm.

[0016] According to a third aspect of the present invention, there isprovided the electronic component placing apparatus according to thesecond aspect, wherein a number of the head units is 2.

[0017] According to a fourth aspect of the present invention, there isprovided the electronic component placing apparatus according to thethird aspect, wherein a length L of the carried board along the carryingdirection is shorter than 250 mm.

[0018] According to a fifth aspect of the present invention, there isprovided the electronic component placing apparatus according to thefirst aspect, wherein moving ranges of the plurality of head units areindependent of each other.

[0019] According to a sixth aspect of the present invention, there isprovided the electronic component placing apparatus according to thefirst aspect, wherein the drive unit has at least a same number of drivemechanisms capable of moving the head units in two directionsperpendicular to each other as that of the plurality of head units.

[0020] According to a seventh aspect of the present invention, there isprovided the electronic component placing apparatus according to thefirst aspect, further comprising a cover for housing the plurality ofhead units and the drive unit,

[0021] wherein the substantial apparatus width is defined by the cover.

[0022] According to an eighth aspect of the present invention, there isprovided a mounted-board producing apparatus comprising the plurality ofelectronic component placing apparatuses according to the first aspect,wherein a board width of the carried board in the carrying direction isshorter than 250 mm; and

[0023] the substantial apparatus width of each of the plurality ofelectronic component placing apparatuses in the carrying direction isnot less than 450 mm and not more than 1000 mm, and a distance betweenthe plurality of electronic component placing apparatuses is equal tothe board width or shorter in the vicinity of positions at which theboard is sent and received.

[0024] According to a ninth aspect of the present invention, there isprovided the mounted-board producing apparatus according to the eighthaspect, wherein

[0025] each of the plurality of electronic component placing apparatusfurther comprises a component feeding unit for feeding the electroniccomponents to the head unit; and

[0026] the component feeding unit is positioned only on one side out oftwo sides of the carrying path of the carrying unit.

[0027] According to a 10th aspect of the present invention, there isprovided the mounted-board producing apparatus according to the eighthaspect, wherein

[0028] each of the plurality of electronic component placing apparatusesfurther comprises a cover for housing the head unit and the drive unit;and

[0029] a distance between the plurality of electronic component placingapparatuses is defined by the cover.

[0030] According to an 11th aspect of the present invention, there isprovided the electronic component placing apparatus according to thefirst aspect, which comprises:

[0031] a protection cover for covering a side of the head unit;

[0032] a first retreat mechanism for retreating the protection coverfrom the head unit;

[0033] a panel which is disposed between the protection cover and thehead unit and has a display; and

[0034] a second retreat mechanism for retreating the panel from the headunit independently of the protection cover.

[0035] According to a 12th aspect of the present invention, there isprovided the electronic component placing apparatus according to the11th aspect, wherein the first retreat mechanism is a mechanism forrotating the protection cover about an upper end of the protectioncover, and the second retreat mechanism is a mechanism for rotating thepanel about an upper end of the panel independently of the protectioncover.

[0036] According to a 13th aspect of the present invention, there isprovided a mounted-board producing apparatus comprising placement workunits for placing the electronic components on the board with solderstherebetween and a reflow work unit for allowing the solders to reflowto fix the electronic components on the board to produce a mountedboard, to produce the mounted board from the board while carrying theboard to the placement work unit and the reflow work unit, whichcomprises:

[0037] a first unit apparatus having either one of the placement workunit and the reflow work unit and having a dimension which is an integernumber of times of a basic dimension along the carrying direction of theboard; and

[0038] a second unit apparatus having the other one of the placementwork unit and the reflow work unit and having a dimension which is aninteger number which is 2 or more of times of the basic dimension alongthe carrying direction of the board,

[0039] wherein the unit apparatus having the placement work unit is theelectronic component placing apparatuses according to claim 1, and

[0040] the first unit apparatus and the second unit apparatus aredisposed serially in the carrying direction and fixed movably.

[0041] According to a 14th aspect of the present invention, there isprovided the mounted-board producing apparatus according to the 13thaspect, wherein each unit apparatus of the first unit apparatus and thesecond unit apparatus comprises:

[0042] a fixing mechanism for fixing the unit apparatus along thecarrying direction; and

[0043] a moving mechanism for releasing fixation of the unit apparatusby the fixing mechanism and moving the unit apparatus off the carryingdirection.

[0044] According to a 15th aspect of the present invention, there isprovided the mounted-board producing apparatus according to the 14thaspect, wherein the fixing mechanism comprises:

[0045] a plurality of pillar elevation mechanisms fixed under a machinebase of the unit apparatus; and

[0046] pillars attached to each of the pillar elevation mechanism so asto be raised from or lowered to an installation surface of the unitapparatus from the machine base,

[0047] the moving mechanism comprises a plurality of wheels that arefixed under the machine base of the unit apparatus and can movablysupport the unit apparatus on the installation surface;

[0048] the unit apparatus is fixed by lowering each of the pillars byeach of the pillar elevation mechanisms to lift each wheel from theinstallation surface and then supporting the unit apparatus by each ofthe pillars on the installation surface; and

[0049] the unit apparatus can be moved by raising each pillar of each ofthe pillar elevation mechanisms and then supporting the unit apparatusby each of the wheels on the installation surface.

[0050] According to a 16th aspect of the present invention, there isprovided the mounted-board producing apparatus according to the 15thaspect, wherein the pillar elevation mechanism comprises a cylinder, andthe pillar attached to the pillar elevation mechanism is movedvertically by operating the cylinder.

[0051] According to a 17th aspect of the present invention, there isprovided the mounted-board producing apparatus according to the 15thaspect, wherein the pillar is a screw shaft, the pillar elevationmechanism is a nut engaged with the screw shaft, and the pillar attachedto the pillar elevation mechanism is moved vertically by reciprocallyrotate the screw shaft relatively to the nut.

[0052] According to an 18th aspect of the present invention, there isprovided the mounted-board producing apparatus according to the 15thaspect, wherein the fixing mechanism further has a depressed portionthat can be engaged to an end portion of the pillar lowered by thepillar elevation mechanism and comprises a pillar receiving portion seton the installation surface.

[0053] According to a 19th aspect of the present invention, there isprovided the electronic component placing apparatus according to thefirst aspect for a mounted-board producing apparatus for producing amounted board by placing the electronic components on the board withsolders therebetween, which comprises:

[0054] a fixing mechanism for fixing the electronic component placingapparatus; and

[0055] a moving mechanism for releasing fixation of the electroniccomponent placing apparatus by the fixing mechanism and then moving theelectronic component placing apparatus,

[0056] wherein the fixing mechanism comprises:

[0057] a plurality of pillar elevation mechanisms fixed under a machinebase of the electronic component placing apparatus; and

[0058] a pillar attached from the machine base to each of the pillarelevation mechanisms so as to be raised from or lowered to theinstallation surface of the electronic component placing apparatus,

[0059] the moving mechanism comprises a plurality of wheels that arefixed under the machine base of the electronic component placingapparatus and can movably support the electronic component placingapparatus on the installation surface,

[0060] the electronic component placing apparatus is fixed by loweringeach pillar by the pillar elevation mechanism to lift each of the wheelsfrom the installation surface and then supporting the electroniccomponent placing apparatus by each of the pillars on the installationsurface, and

[0061] the electronic component placing apparatus can be moved byraising each of the pillars by each of the pillar elevation mechanismsand then supporting the electronic component placing apparatus by therespective wheels on the installation surface.

[0062] According to a 20th aspect of the present invention, there isprovided an electronic component placing apparatus, wherein the headunit comprises a placing unit for placing the electronic components fedfrom the electronic component feeding unit on the board and arecognition unit for recognizing this board,

[0063] the electronic component placing apparatus comprises:

[0064] an X-axis direction moving apparatus for moving the head unit inan X direction, which is a direction of carrying the board; and

[0065] a Y-axis direction moving apparatus for moving this X-axisdirection moving apparatus in a Y direction perpendicular to the Xdirection,

[0066] wherein the X-axis direction moving apparatus is disposed belowthe Y-axis direction moving apparatus and above the board.

[0067] According to a 21st aspect of the present invention, there isprovided the electronic component placing apparatuses according to the20th aspect, wherein the Y-axis direction moving apparatus is disposedalmost immediately above a component placement position at which theelectronic components are placed on the board.

[0068] According to a 22nd aspect of the present invention, there isprovided the electronic component placing apparatuses according to the20th aspect, wherein the X-axis direction moving apparatus isconstituted by a linear motor.

[0069] According to a 23rd aspect of the present invention, there isprovided the electronic component placing apparatuses according to the20th aspect, wherein the recognition unit is deviated from the placingunit in the Y direction.

BRIEF DESCRIPTION OF THE DRAWINGS

[0070] These and other aspects and features of the present inventionwill become clear from the following description taken in conjunctionwith the preferred embodiments thereof with reference to theaccompanying drawings, in which:

[0071]FIG. 1A is a perspective view showing an electronic componentplacing system in a mounted-board producing apparatus according to afirst embodiment of the present invention;

[0072]FIG. 1B is a perspective view showing a board on which electroniccomponents are mounted in the electronic component placing system;

[0073]FIG. 2 is a showing a perspective view showing a high-speedplacing apparatus in the electronic component placing system;

[0074]FIG. 3 is a perspective view showing the high-speed placingapparatus in FIG. 2 by seeing through an upper cover;

[0075]FIG. 4 is a front view showing the high-speed placing apparatus;

[0076]FIG. 5 is a view showing how an operator operates the high-speedplacing apparatus;

[0077]FIG. 6 is a view showing how the operator operates the high-speedplacing apparatus;

[0078]FIG. 7 is a bottom view showing a placing mechanism of thehigh-speed placing apparatus;

[0079]FIG. 8 is a plan view showing a portion below the placingmechanism of the high-speed placing apparatus;

[0080]FIG. 9 is a side view showing the high-speed placing apparatus;

[0081]FIG. 10 is a view showing a state that a protection cover of thehigh-speed placing apparatus is open;

[0082]FIG. 11 is a view showing a state that an operation panel of thehigh-speed placing apparatus is retreated from a head unit;

[0083]FIG. 12 is a perspective view showing a conventional electroniccomponent placing system;

[0084]FIG. 13 is a perspective view showing a mounted-board producingapparatus according to a second embodiment of the present invention;

[0085]FIGS. 14A and 14B are schematic explanatory views showingstructures of a fixing unit and a moving unit, respectively, of a unitapparatus in the second embodiment;

[0086]FIGS. 15A, 15B and 15C are schematic explanatory views showing amoving operation and a fixing operation of the unit apparatuses of thesecond embodiment;

[0087]FIGS. 16A, 16B, 16C, 16D and 16E are schematic plan views showingarrangement of unit apparatuses in the mounted-board producing apparatusof the second embodiment;

[0088]FIGS. 17A and 17B are schematic explanatory views showingstructures of a fixing unit and a moving unit, respectively, of unitapparatuses in a mounted-board producing apparatus according to a thirdembodiment of the present invention;

[0089]FIG. 18 is a perspective view showing a conventional mounted-boardproducing apparatus;

[0090]FIG. 19 is a general schematic perspective view showing aconventional electronic component placing apparatus;

[0091]FIG. 20 is a structural view showing a conventional X-Y robot inthe electronic component placing apparatus;

[0092]FIG. 21 is a detailed structural view showing an X-Y robot of anelectronic component placing apparatus according to a fourth embodimentof the present invention;

[0093]FIG. 22 is a schematic structural view showing the X-Y robot ofthe electronic component placing apparatus according to the fourthembodiment of the present invention;

[0094]FIG. 23 is a schematic perspective view showing a head unitsupported by the X-Y robot of the electronic component placing apparatusin the fourth embodiment of the present invention, from which nozzlesare omitted;

[0095]FIG. 24 is a structural view showing an X-Y robot of a specificexample where the fourth embodiment of the present invention is appliedto the electronic component placing apparatus of the first embodiment;

[0096]FIG. 25 is a structural view showing the inside of a conventionalhead unit of an electronic component placing apparatus; and

[0097]FIG. 26 is a showing the structural view inside of a head unit ofthe electronic component placing apparatus according to the fourthembodiment of the present invention shown in FIG. 24.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0098] Before the description of the present invention proceeds, it isto be noted that like parts are designated by like reference numeralsthroughout the accompanying drawings.

[0099] Embodiments of the present invention are described in detail withreference to the accompanying drawings.

[0100] First Embodiment

[0101]FIG. 1A is a perspective view showing an external appearance of anelectronic component placing system 2 constituted by a plurality ofelectronic component placing apparatuses in a mounted-board producingapparatus 1 according to a first embodiment of the present invention.FIG. 1B is a perspective view showing a board 8 on which electroniccomponents 99 are mounted by the plurality of electronic componentplacing apparatuses in the electronic component placing system 2. Theelectronic component placing system 2 is disposed between a printer 11and reflow apparatus 12 of solder pastes in the mounted-board producingapparatus 1 for mounting electronic components 99 on the board 8.

[0102] The electronic component placing system 2 has five high-speedplacing apparatuses 21 (as one example of the electronic componentplacing apparatus) and three multifunctional placing apparatuses 22 (asanother example of the electronic component placing apparatus), and aninspection apparatus 23 for inspecting a placed state of electroniccomponents is disposed between the high-speed placing apparatuses 21 andthe multifunctional placing apparatuses 22. Furthermore, since thehigh-speed placing apparatuses 21, the inspection apparatus 23, and themultifunctional placing apparatuses 22 are disposed in one line, a pathfor carrying a board 8 is formed in these apparatuses.

[0103] The board 8 on which solder pastes are printed is carried fromthe printer 11 into the high-speed placing apparatus 21 in a directionshown with an arrow 70, and a multiplicity of micro electroniccomponents 99 a are successively placed on the solder pastes on theboard 8 by the five high-speed placing apparatuses 21. Then, whether theelectronic components are appropriately placed is inspected by theinspection apparatus 23, and various relatively large electroniccomponents 99 b are placed on a board 8 that has passed the inspection,by the multifunctional placing apparatus 22.

[0104] The board 8 on which placement of various electronic components99 is completed is carried out of the electronic component placingsystem 2 in a direction shown with an arrow 71 into the reflow apparatus12. Then, melting and solidification of the solder pastes is performed,and thus mounting of the electronic components 99 on the board iscompleted.

[0105]FIG. 2 is an external perspective view showing the front side,right side, and top of the high-speed placing apparatus 21 for placingelectronic components on a board at high speed. The multifunctionalplacing apparatus 22, which places many types of electronic componentson a board, has the same structure as the high-speed placing apparatus21 except that configurations for feeding or holding components aredifferent. Furthermore, X, Y, and Z directions shown in FIG. 2 representa direction from the right side to the left side, a direction from thefront side to the rear, and a direction from the lower side to the upperside, respectively, facing the front side.

[0106] The high-speed placing apparatus 21 has a substantiallyrectangular parallelepiped shape covered with an upper cover 31 and alower cover 32, and the front surface of the upper cover 31 constitutesa protection cover 75 that can be opened and closed. Two openings 75 a,75 b, upper and lower, are formed in the protection cover 75, and anoperation panel 33 is disposed inside the protection cover 75 as opposedto the upper opening 75 a. A transparent acrylic plate is attached tothe lower opening 75 b to form a window 81 for checking the inside ofthe apparatus.

[0107] A pair of parallel carrier rail members 77, which penetratelaterally the inside of the high-speed placing apparatus 21, are laidbetween the upper cover 31 and the lower cover 32. The left and rightopenings of the high-speed placing apparatus 21, through which the pairof carrier rail members 77 are slightly projected, constitute ports 98for carrying in and out a board. Furthermore, as described later, theboard 8 is carried on the pair of carrier rail members 77 towards apredetermined carrying direction ((+X) direction) by the drive of aboard carrying belt of the pair of carrier rail members 77.

[0108]FIG. 3 is a perspective view showing the internal structure of thehigh-speed placing apparatus 21 by omitting the upper cover 31,operation panel 33, and so forth. As shown in FIG. 3, two placingmechanisms 4 for placing electronic components are disposed in parallelin the X direction inside the upper cover 31, and a multiplicity ofcomponent cassettes 5 are attached from the rear of the high-speedplacing apparatus 21. In FIG. 3, a frame 97 for supporting the placingmechanisms 4 is seen-through.

[0109] The pair of carrier rail members 77 are connected to a carryingdrive unit 78, and the carrying drive unit 78 drives a motor to adjustan interval between the pair of carrier rail members 77 by a widthadjusting mechanism connected to a power transmission mechanism of themotor and perform a reciprocal drive of the board carrying belt in thepair of carrier rail members 77 by switching the drive of the powertransmission mechanism from the motor.

[0110] In the pair of carrier rail members 77, pairs of carrying beltsfor determining a retreat position, carrying belts for determining aplacement position, carrying belts for determining a retreat position,carrying belts for determining a placement position, and carrying beltfor carrying out of the placement position may be disposed from theright end towards the left end, and the drive of each carrying belt maybe independently controlled by the carrying drive unit 78.

[0111] Furthermore, a control unit 6 for controlling the placingmechanism 4, component cassettes 5, carrying drive unit 78, and so forthis housed inside the lower cover 32. Therefore, the high-speed placingapparatus 21 can be solely operated even in a state that no otherapparatuses exist therearound.

[0112] In the high-speed placing apparatus 21, an operation where a headunit 41 of the placing mechanism 4 receives electronic components 99from the component cassettes 5 and the electronic components 99 areplaced onto a board 8 carried on the pair of carrier rail members 77 isrepeated. First, the size and the arrangement of component members ofthe high-speed placing apparatus 21 are explained before detailexplanation of each component member. It is noted that the followingexplanation of the size and the arrangement of component members of thehigh-speed placing apparatus 21 is similarly applicable to themultifunctional placing apparatus 22.

[0113] The high-speed placing apparatus 21 is designed as a machineexclusively used for placing electronic components on a small-size board(for example, a quadrilateral board with one side of shorter than 250mm). That is, this apparatus is a machine exclusively used formanufacturing a small board for a portable terminal including a cellularphone. Consequently, the production capacity is lower than that of onelarge-size production line conventionally used, but a manufacture thatis advantages in view of yield and switching of the types of boards isrealized.

[0114] Specifically, by handling a small-size board, a loss caused bydisposal of one board can be made smaller than in the case of alarge-size board (for example, a quadrilateral board with one side of250 mm or longer). Furthermore, by reducing the size of the high-speedplacing apparatus 21 itself as a machine exclusively used for small-sizeboards, a heavy work load required to switch the types of boards isrelieved. By reducing the size of the high-speed placing apparatus 21itself, a larger number of production lines can be installed in the samelocation than in the conventional case. Therefore, productivity per aninstallation area is not necessarily lowered, but may be improved.

[0115] Furthermore, by installing a multiplicity of lines in a locationhaving the same area, degradation of the production capacity due to astop of one line can be prevented. Thus, a new added value can beobtained by using the small-size high-speed placing apparatus 21exclusively used for small-size boards. In comparison with aconventional electronic component placing system 9 shown in FIG. 12, thelength of the electronic component placing system 2 shown in FIG. 1A isreduced to ¼ to ⅓ thereof by reducing the sizes of the high-speedplacing apparatuses 21 and the multifunctional placing apparatuses 22.

[0116] With the above reasons, the high-speed placing apparatus 21 isdesigned as a placing apparatus made smaller to be exclusively used forsmall-size boards. Furthermore, the size and the structure of thehigh-speed placing apparatus 21 are optimized based on viewpoints ofhuman engineering and considerations to productivity.

[0117] As shown in FIG. 4, when the apparatus width when viewed from thefront (that is, a substantial apparatus width in the carrying direction)is assumed as AW and the apparatus height is H, H is inevitablyincreased if the apparatus size is reduced (precisely, reduction of theoccupation area). However, as shown in FIG. 5, since the height MH, atwhich an operator can perform works such as maintenance of theapparatus, initial adjustment, drive operation, and so forth, that is,the height in view of operatability is usually about 2000 mm, theapparatus height H is also preferably limited to about 2000 mm.Furthermore, limiting the apparatus height H to about 2000 mm is alsopreferable since the apparatus can be reached (edges of the apparatuscan be touched by extending the hands of an operator) without using apedestal in view of safety. From these viewpoints, the apparatus heightis used to be about 1300-2000 mm.

[0118] Meanwhile, in new installment of the high-speed placing apparatus21 or rearrangement of the line configuration, the high-speed placingapparatus 21 needs to be transported. At this time, if the apparatuswidth AW is too small, it is difficult to support the high-speed placingapparatus 21 in a stable manner. Here, when it is assumed that arestoring force needs to be generated so that the apparatus attitudereturns to the original standing attitude even if the centroid of theapparatus coincides with the center of the apparatus and the inclinationof the apparatus is about 20°, the height H and the width AW need tosatisfy the following mathematical expression.

H·tan20°<AW

[0119] As a result, it can be concluded that, when the height H is about1300 mm, the width AW needs to be at least 450 mm, and when the height His about 2000 mm, the width AW needs to be at least 600 mm. Therefore,the apparatus does not fall and the attitude thereof can be restoredeven if the apparatus is inclined at installation of the apparatus, anddamage and a load to the apparatus itself can be relieved.

[0120] On the other hand, when the operator performs an operation or awork as opposed to the high-speed placing apparatus 21 as shown in FIG.6, the operation or work becomes difficult if the apparatus width AW istoo small. In particular, much labor is required to perform works insidethe apparatus such as attachment of component cassettes 5 in theapparatus, lubrication and initial value adjustment for head units 41and carrier rail members 77, replacement of nozzles 86, adjustment of arecognition camera, and so forth.

[0121] Furthermore, when one of a plurality of arranged high-speedplacing apparatuses 21 is removed and an operator works in the gapgenerated by the removal, the work itself is impossible without a gap ofat least 450 mm since the operator needs to bend down particularly inworks for the lower portion of the apparatus. Since the operator widthMW1 is generally about 600-650 mm and a gap that allows an operator toenter is preferably at least 600 mm, a apparatus width AW morepreferably needs to be about 600 mm.

[0122] From the above, the width AW of the high-speed placing apparatus21 needs to be 450 mm or greater, preferably about 600 mm (when “about”is interpreted as in the range of ±10%, 540-660 mm is obtained) from theviewpoints of human engineering or operatability.

[0123] It is needless to say that, as the apparatus width AW isincreased, the attitude of the apparatus becomes more stable and the gapgenerated by removal of an apparatus becomes larger. However, when theapparatus is made larger, as described above, works for switching thetypes of boards or replacement of the apparatus require much labor.Therefore, this is not preferable from the viewpoint of handling of manytypes of small-size boards. Furthermore, when the apparatus width AW istoo large, an operator needs to move to perform an operation orconfirmation work for one apparatus. Therefore, the apparatus width AWis preferably limited to a width MW2 of 1000 mm or smaller, with whichan operator can work with both arms extended.

[0124] As described above, as a placing apparatus exclusively used forsmall-size boards, the width is preferably not less than 450 mm not morethan 1000 mm, more preferably about 600 mm. Accordingly, the width AW ofthe high-speed placing apparatus 21 is about 600 mm.

[0125] The apparatus width AW refers to a substantial width and does notinclude protrusions existing in the outer periphery of the apparatus orattached members in view of the width. Specifically, when the placingmechanism 4 including the head unit 41 is covered with a cover toprotect the apparatus and the operator as shown in FIG. 3, the widthdefined by the cover can be defined as a substantial apparatus width,and if the apparatus is not covered with a cover, the width defined bythe frame of the apparatus can be defined as a substantial apparatuswidth.

[0126]FIG. 7 shows two placing mechanisms 4 viewed from below. A headunit 41 of the placing mechanism 4 has ten nozzles 86 for receivingelectronic components from the component cassettes 5 by suction and canbe moved in the X direction by a drive mechanism 42 having a linearmotor as a drive source as one example of a drive unit. Furthermore, thedrive mechanism 42 can also be moved in the Y direction by a drivemechanism 43 having a linear motor as a drive source as one example of adrive unit. Therefore, a moving range required for movement of themechanism constituted by the drive mechanism 42 and the drive mechanism43 is a region shown with a reference numeral 83 in FIG. 7.

[0127] Each nozzle 86 of the head unit 41 can move vertically and rotateabout a shaft extending in the Z direction. Consequently, the electroniccomponents sucked by the nozzles 86 can be placed on a board in variousdirections.

[0128] As shown in FIG. 7, the moving ranges 83 of two placingmechanisms 4 are not overlapped and made independent. Consequently, thetwo placing mechanisms 4 can be independently controlled, andprogramming for control becomes easy. Furthermore, since the same numberof drive mechanisms 42, 43 as the head units 41 exist, each head unit 41can be controlled in a completely independent manner and thus controlledeven more easily.

[0129] In the high-speed placing apparatus 21, the two placingmechanisms 4 are disposed as shown in FIG. 3. As described above, thisis the case where the apparatus width AW is made about 600 mm. When theapparatus is designed as an apparatus exclusively used for small-sizeboards, this is a usual constitution because disposition of two placingmechanisms 4 is an optimal design from the viewpoint of the size of theplacing mechanism 4 which are made smaller. In particular, when themoving ranges 83 of the placing mechanisms 4 do not interfere with eachother as shown in FIG. 7, disposition of two placing mechanisms 4 ispreferable in view of rigidity of the placing mechanisms 4 and size ofan available linear motor.

[0130] Furthermore, in the high-speed placing apparatus 21, the placingmechanisms 4, component cassettes 5 and so forth are disposed so as tobe left-and-right symmetrical (left-and-right symmetrical with respectto a direction perpendicular to the carrying direction). The high-speedplacing apparatus 21 has a structure long in the height direction tominimize the occupied floor area. Therefore, it is highly likely thatthe high-speed placing apparatus 21 is inclined laterally when theapparatus is transported. Accordingly, by adopting an almostleft-and-right symmetrical structure in the high-speed placing apparatus21, the attitude of the high-speed placing apparatus 21 is made stablewhen transported or installed. The aforementioned equation 1 is based ona prerequisite that the centroid of the high-speed placing apparatus 21is located almost at the center, such a prerequisite is provided byconsidering that the high-speed placing apparatus 21 has an almostleft-and-right symmetrical structure.

[0131] Furthermore, the length of one side of the quadrilateral of theboard 8 is determined by, for example, dividing 1000 mm equally.Therefore, as the length of one side of the quadrilateral (for example,square) of the board, 500 mm, 330 mm, 250 mm, 200 mm, and so forth areadopted. If the length of one side of the board square is 100 mm,10-length×10-width=total 100 boards are connected and constitute oneboard 8 for producing multiple boards which has a length of one side ofthe square of 1000 mm. Here, when a small-size board having a length ofone side of the quadrilateral of less than 250 mm is handled, there canbe physically two or more boards 8 that can exist in the apparatus bymaking the apparatus width AW about 600 mm. As a result, disposition oftwo placing mechanisms 4 is a design more appropriate than dispositionof one.

[0132]FIG. 8 is a plan view showing the configuration below the headunit 41. Hereafter, operations of the high-speed placing apparatus 21are explained with reference to FIGS. 7 and 8. FIG. 8 shows an examplewhere electronic components 99 are placed on a board 8 with 100 mmsquare.

[0133] When a board 8 is positioned from the outside of the apparatus toa board retreat position P1, then from the board retreat position P1 toa component placement position P2 generally below the placing mechanism4 for the first placing mechanism 4 while sandwiched by a pair ofcarrier rail members 77 (when positioned from the component placementposition P2 of the first placing mechanism 4 to a board retreat positionP3, then from the board retreat position P3 to a component placementposition P2 generally below the placing mechanism 4 of a second placingmechanism 4 for the second placing mechanism 4), the head unit 41 movesto the component cassette 5 side. The component cassette 5 has a reel towhich a tape having electronic components 99 placed thereon is wound asshown in FIG. 3, and when the tape is fed out from the reel to an end ofthe component cassette 5 (end on the side of the pair of carrier railmembers 77), the electronic components 99 are fed to the side of thepair of carrier rail members 77.

[0134] Usually, when an apparatus is made smaller in size, many types ofelectronic components 99 are placed by feeding the electronic components99 from both sides of a carrying path. In this case, a componentcassette 5 for spare electronic components 99, that is, for replacementneeds to be disposed both in front and rear of the apparatus, and hencethis eventually prevents the mounting system from substantially beingmade smaller. However, in this high-speed placing apparatus 21, as shownin FIG. 8, component cassettes 5 are positioned only on one side of thepair of carrier rail members 77. Consequently, while the apparatus ismade smaller, spare electronic components 99 need to be prepared only inthe rear of the apparatus, and thus the occupation area can be reliablyreduced substantially.

[0135] In FIGS. 7 and 8, a region shown with reference numeral 84represents a region where nozzles 86 of the head unit 41 suck electroniccomponents 99. When electronic components 99 are taken out of thecomponent cassettes 5 in the region 84, the head unit 41 moves to abovethe board 8. A region shown with reference numeral 85 in FIG. 7 is aregion where the head unit 41 places the electronic components 99 on theboard 8, and the board 8 is positioned in this region 85. In the exampleshown in FIG. 8, a 100 mm board 8 is handled in the high-speed placingapparatus 21, and electronic components 99 are simultaneously placedonto two boards 8 positioned at the component placement positions P2located directly below the two placing mechanisms 4 out of four boards 8positioned on the retreat position P1, component placement position P2,retreat position P1, and component placement position P2 on the pair ofcarrier rail member 77.

[0136] When the head unit 41 is positioned above the boards 8 by thedrive mechanism 42 and the drive mechanism 43, the direction of eachnozzle 86 (the direction of rotation about the nozzle central shaftgenerally on a horizontal plane) is adjusted, and then the nozzles 86are lowered so that the electronic components 99 are placed on solderpastes on the board 8. This is not shown in FIG. 8, but, when theelectronic components 99 are sucked by the nozzles 86, states of thesucked electronic components 99 are checked by using a camera.

[0137] By the operations described above, suction of the electroniccomponents 99 from the component cassettes 5 and placement of theelectronic components 99 onto the board 8 are repeated by the placingmechanisms 4, and thus required electronic components 99 are placed ontwo boards 8 at the component placement positions P2 directly below thetwo placing mechanisms 4. When the placement of the electroniccomponents 99 is completed, the board 8 is carried from the componentplacement position P2 to a position outside of the component placementposition P2, from right to left in FIG. 8 (in the (+X) direction) bydrive of the pair of carrier rail member 77 by the carrying drive unit78, and a new board 8 is positioned from the retreat position P1 or P3to the component placement position P2 directly below the placingmechanism 4. At this time, one board 8 is carried in from the right sidesurface of the high-speed placing apparatus 21 onto the pair of carrierrail members 77, and one board 8 at the left end is carried out of thepair of carrier rail members 77 from the left side surface.

[0138] Next, arrangement of a plurality of high-speed placingapparatuses 21 is explained below with reference to FIG. 8.

[0139] As shown in FIG. 8, a gap between the high-speed placingapparatuses 21 that are adjacent to each other (hereinafter, referred tosimply as “distance between the apparatuses”) is restricted to a verynarrow dimension. For example, in FIG. 8, the apparatus width AW of ahigh-speed placing apparatus 21 is 600 mm, and a gap C between twoadjacent high-speed placing apparatuses 21 is 55 mm. The length of theportions of the pair of carrier rail members 77 protruded from the sidesurface of the apparatus is 25 mm, and a gap between the pairs ofcarrier rail members 77 of the adjacent apparatuses is 5 mm.Consequently, the width AW of the high-speed placing apparatus 21 isrestricted, and the length of the electronic component placing system 2when a plurality of high-speed placing apparatuses 21 are arranged canbe restricted to be short.

[0140] In general, the distance between conventional placing apparatusesis a length with which an operator can remove a board (however, this isnot applicable to the case where a particularly large board is handled).That is, the distance between the apparatuses is set to be longer thanthe length parallel to the carrying direction out of the lengths of theboard. The length is thus set for the purpose of removing a board withelectronic components defectively placed thereon as required immediatelyafter carried out from the apparatus.

[0141] On the other hand, in the high-speed placing apparatus 21according to the first embodiment, although a small-size board, inparticular, a board having a board width in the carrying direction ofless than 250 mm is handled, the distance between the apparatuses can beset to be equal to the board width in the carrying direction or shorter.Consequently, the length of the electronic component placing system 2can be made very short (that is, the length of the mounted-boardproducing apparatus 1 can be made shorter), and freedom can be achievedto the layout when the whole mounted-board producing apparatus 1 isinstalled.

[0142] Furthermore, since the length of the mounted-board producingapparatus 1 is made shorter, the number of boards 8 placed on thecarrier line (particularly, the number of boards 8 existing within theelectronic component placing system 2) can be inevitably reduced. As aresult, the number of in-process boards 8 can be reduced, and hence thenumber of boards 8 discarded at the time of switching of the types ofboards 8 or trouble of the placing system can be reduced.

[0143] An operation panel 33 in the high-speed placing apparatus 21 isexplained below. In the high-speed placing apparatus 21, since theapparatus width AW is restricted to be small, the operation panel 33 isattached by a method different from conventional methods. Usually, whenthe gap between apparatuses is sufficiently wide, the operation panel isdisposed between the apparatuses. Furthermore, when the height of theapparatus is low, the operation panel is disposed on top of theapparatus.

[0144] As described above, since the gap between the apparatuses is setto be small, and the height of the apparatus can be set to be high sothat the apparatus width AW is restricted to small in the high-speedplacing apparatus 21. Accordingly, the operation panel 33 is disposedinside the apparatus. At least when the distance between the apparatusesis smaller than the width of the operation panel 33, the operation panel33 needs to be disposed on top of or inside the apparatus. When theheight of the apparatus exceeds 1500 mm, the operation panel 33inevitably needs to be disposed inside the apparatus in view ofoperatability. In the high-speed placing apparatus 21, as shown in FIG.2, the operation panel 33 is disposed between the front protection cover75 and the head unit 41.

[0145] As shown in FIG. 2, a display 74 for displaying variousinformation for an operator, operation buttons 79 for receiving variousoperations from the operator, a stop button 80 for an emergency stop,and so forth are arranged on the operation panel 33. The protectioncover 75 is supported rotatably by a pair of hinges 73 at an upper endas one example of a first retreat mechanism. Consequently, theprotection cover 75 can be opened or closed about the hinges 73 as thecenter from the state shown in FIG. 9 to the state shown in FIG. 10.

[0146] However, in the state shown in FIG. 10, while the operator canwork for the portion below the head unit 41, works for an upper portionof the placing mechanism 4 or the front of the head unit 41 aredifficult due to the operation panel 33 as a shield.

[0147] Accordingly, in the high-speed placing apparatus 21, as oneexample of a second retreat mechanism, a hinge 76 is provided at theupper end of the operation panel 33 and the operation panel 33 canrotate about the hinge 76 from the state shown in FIG. 10 to the stateshown in FIG. 11. Consequently, the operation panel 33 including thedisplay 74 can be retreated from the head unit 41, and works for thehead unit 41 and works for the upper portion of the placing mechanism 4can be easily performed.

[0148] The first embodiment of the present invention has been explainedabove, but the scope of the present invention is not limited to theabove embodiment and can be modified in various manners.

[0149] For example, the above explanation has mainly been about thereduction of the size of the high-speed placing apparatus 21, but, asdescribed above, a multifunctional placing apparatus 22 for placing manytypes of electronic components 99 can be similarly designed by changingthe configuration of feeding of electronic components 99 or the shapesof nozzles of the head unit 41. That is, the configuration of feeding ofcomponents 99 is not limited to a tape method, but a tray method, whereelectronic components 99 are arranged on a tray, or other methods may beadopted. Furthermore, electronic components 99 do not necessarily needto be sucked and held by nozzles 86, but electronic components 99 may beheld by the head unit 41 by other means such as a mechanical chuck orthe like. Thus, the placing apparatus according to the first embodimentcan be utilized as a placing apparatus for placing various electroniccomponents 99 on a board 8. The following various modified examples canalso be applied to a multifunctional placing apparatus 22.

[0150] In the first embodiment, a board 8 is carried linearly along apair of carrier rail members 77, but the carrying direction does notneed to be precisely linear so long as an approximate carrying directionis determined. For example, when electronic components 99 are placed onthe board 8, the board 8 may be slightly lifted instead of loweringnozzles 86, or, furthermore, the board 8 may be carried to a positionoff the pair of carrier rail members 77. Furthermore, the carryingmethod is not limited to a method using a pair of carrier rail members,but the board 8 may be carried on a belt conveyer, or the board 8 may becarried while being held by a mechanical chuck or a vacuum chuck.

[0151] In the first embodiment, an optimum design is achieved bydisposing two head units 41 under a precondition that the apparatuswidth AW is about 600 mm. When the apparatus width AW is about 1000 mmor a new mechanism is developed as a placing mechanism 4, three or morehead units 41 can be disposed.

[0152] Furthermore, in the first embodiment, the head unit 41 of theplacing mechanism 4 moves in two directions perpendicular to each other,but, naturally, the head units 41 may be able to move in a verticaldirection.

[0153] In the first embodiment, it is explained that the distancebetween the placing apparatuses is set to be less than the board widthin the carrying direction, but, naturally, the distance between theapparatuses does not include unnecessary protrusions in the outerperiphery of the apparatuses or additional component members in view ofthe distance. In the electronic component placing system 2 according tothe first embodiment, although a small-size board is handled, thedistance between the apparatuses is reduced to such an extent thatremoval of a board is impossible between the apparatuses, therebyminimizing the electronic component placing system 2 to the limit.

[0154] Therefore, the distance between apparatuses refers to a distancein the vicinity of positions at which a board 8 is sent and receivedbetween the apparatus. When a placing mechanism 4 including a head unit41 is covered with covers to protect the apparatuses and the operator,the distance between apparatuses can be defined as a distance betweenthe covers in the vicinity of the positions at which the board 8 is sentand received. Alternatively, the distance between apparatuses can alsobe defined as a distance over which a board 8 is carried from the timewhen an end of a carried-out board 8 is seen outside the cover to thetime when the end of the board 8 is carried into the cover of the otherapparatus.

[0155] Naturally, no cover may exist depending on the apparatus. Even inthis case, generally, since the apparatuses are surrounded by frames,the distance between apparatuses can be defined as a distance betweenthe frames in the vicinity of the positions at which the board 8 is sentand received.

[0156] In the first embodiment, the protection cover 75 covering theside of the head unit 41 and the operation panel 33 can be retreatedfrom the head unit 41 by using rotation mechanisms (that is, hinges 73,76 as one example) so as to rotate about their respective upper ends.However, the hinges 73, 76 are only adopted to appropriately retreat theprotection cover 75 and the operation panel 33 in the simplestconfiguration, and the protection cover 75 and the operation panel 33may be able to be retreated independently by other retreat mechanisms.For example, the protection cover 75 and the operation panel 33 may beretreated to above the apparatus by sliding mechanisms, or to a side ofor below the apparatus so long as they do not interfere with otherconfigurations or adjacent apparatuses.

[0157] Furthermore, the operation panel 33 may include only a display74, and the operation buttons may be separately provided. Furthermore,the operation panel 33 may be constituted by disposing a touch panel onthe display 74. That is, the operation panel 33 may be defined as oneexample of a panel having at least a display 74.

[0158] According to first to seventh aspects of the present invention,an electronic component placing apparatus can be appropriately madesmaller.

[0159] Furthermore, according to the second aspect of the presentinvention, an electronic component placing apparatus can be moreappropriately made smaller, and, according to the third aspect of thepresent invention, the electronic component placing apparatus that ismade smaller can be appropriately configured.

[0160] Furthermore, according to the fourth aspect of the presentinvention, an electronic component placing apparatus can beappropriately made smaller depending on the size of a handling board.

[0161] Furthermore, according to the fifth aspect of the presentinvention, movement of a head unit can be easily controlled, and,according to the sixth aspect of the present invention, movement of thehead unit can be more easily controlled.

[0162] Furthermore, according to the seventh aspect of the presentinvention, an electronic component placing apparatus and an operator canbe protected by a cover.

[0163] According to eighth to tenth aspects of the present invention,the whole mounted-board producing apparatus, particularly, an electroniccomponent placing system constituted by a plurality of component placingapparatuses can be made smaller.

[0164] Furthermore, according to the ninth aspect of the presentinvention, a substantial occupation area of the whole mounted-boardproducing apparatus, particularly, an electronic component placingsystem constituted by a plurality of component placing apparatuses canbe reduced.

[0165] Furthermore, according to the tenth aspect of the presentinvention, an electronic component placing apparatus and an operator canbe protected by a cover.

[0166] According to the 11th and 12th aspects of the present invention,works for the rear of the display can be easily performed.

[0167] Furthermore, according to the 12th aspect of the presentinvention, a display can be retreated by a simple mechanism.

[0168] Second and Third Embodiments

[0169] Second and third embodiments of the present invention relate to amounted-board producing apparatus including a placement work unit forplacing a plurality of electronic components on a board with solderstherebetween, and a reflow work unit for allowing the solders to reflowto fix the electronic components on the board, wherein, while aplurality of the boards are carried into the placement work unit and thereflow work unit, a plurality of mounted boards are produced from theplurality of boards.

[0170] Conventionally, various structures of this type of mounted-boardproducing apparatus are known. For example, a conventional mounted-boardproducing apparatus 1201, as shown in FIG. 18, is disposed on a carrierline and, by a plurality of types of work apparatuses performingpredetermined works for boards, electronic components are mounted on aplurality of boards successively carried in these work apparatuses toproduce mounted boards.

[0171] In FIG. 18, the mounted-board producing apparatus 1201 includes aplurality of work apparatuses performing predetermined works for boards,and also includes a board feeding apparatus 1210, in which a pluralityof boards are housed so that the plurality of boards on which electroniccomponents are mounted in the mounted-board producing apparatus 1201 canbe fed to an adjacent work apparatus, a printer 1220 for printing creamsolder pastes on electrodes of a board, electronic component placingapparatuses 1230 and 1231 for placing electronic components on theelectrodes of the board via the solders, a reflow apparatus 1240 forfixing the electronic components placed on the board by allowing thesolders to reflow, and a board removing apparatus 1250 for removingmounted boards on which electronic components are mounted from thereflow apparatus 1240 and then housing them, in this order from theright side of the figure. Furthermore, these work apparatuses areinstalled adjacent to each other.

[0172] In such a mounted-board producing apparatus 1201, when a mountedboard is produced, a plurality of boards on which electronic componentare to be mounted are successively carried inside the work apparatusesfrom the board housing apparatus 1210 to the board removing apparatus1250, and predetermined works are performed for each board in each ofthe work apparatuses to produce a plurality of mounted boards.

[0173] However, in the apparatus having the above structure, when typesof mounted boards to be produced are switched, for example, the numberof types of electronic components to be placed may be increased to alarge number in some cases. In such cases, in the mounted-boardproducing apparatus 1201, an electronic component placing apparatus forplacing an increased number of electronic components needs to be newlyadded. In this case, in the mounted-board producing apparatus 1201, thereflow apparatus 1240 and the board removing apparatus 1250 are moved,and then the aforementioned new electronic component placing apparatusis positioned for additional installment. Then, according to thisposition, the installation positions of the reflow apparatus 1240 andthe board removing apparatus 1250 need to be adjusted. An issue arisesthat it is not easy to move the apparatuses since these work apparatusesare heavy goods.

[0174] Furthermore, since each of the work apparatuses constituting themounted-board producing apparatus 1201 has an individual width along theboard carrying direction, for example, when another type of electroniccomponent placing apparatus 1232 is installed to replace the electroniccomponent placing apparatus 1231, the width of the electronic componentplacing apparatus 1231 and that of the electronic component placingapparatus 1232 may be different from each other. In this case, thereflow apparatus 1240 and the board removing apparatus 1250 also need tobe moved, and an issue arises that a replacement work of the workapparatuses constituting the mounted-board producing apparatus 1201becomes an extensive work, which is not easy.

[0175] Accordingly, an object of the present invention is to provide amounted-board producing apparatus including a plurality of unitapparatuses for performing predetermined works for a board and producinga mounted board by mounting electronic components on the board, and anelectronic component placing apparatus for a mounted-board producingapparatus as one of the aforementioned unit apparatuses used in themounted-board producing apparatus, with which each of the unitapparatuses can be easily replaced, moved, and fixed; and positions ofthe unit apparatuses are easily changed, and thus solve theaforementioned issues.

[0176] Hereafter, embodiments of the present invention are explained indetail with reference to the accompanying drawings.

[0177] As shown in FIG. 13, the mounted-board producing apparatus 1101according to the second embodiment of the present invention includes aplurality of unit apparatuses 1001 as one example of unit apparatuseseach including a work unit for performing predetermined works for theboard 8, and includes a printer 1110 for printing cream solder pastes onelectrodes on a plurality of boards fed into the mounted-board producingapparatus 1101, electronic component placing apparatuses 1120, 1121, and1122 each equipped with a placement work unit for placing electroniccomponents 99 on the electrodes of the board via the solders, and areflow apparatus 1130 equipped with a reflow work unit for fixing theelectronic components placed on the board via the solders by allowingthe solders to reflow, in this order from the right side of the figure.Here, an electronic component placing apparatus constituted by unitapparatuses equipped with the aforementioned placement work unitsconstitutes the electronic component placing apparatus according to thefirst embodiment.

[0178] Since the unit apparatuses each include a carrying device forcarrying boards and are installed adjacent to each other, a carrier line1140 that can sequentially carry a plurality of boards inside therespective unit apparatuses 1001 from the printer 1110 to the reflowapparatus 1130 is formed by the carrying devices included in therespective unit apparatuses 1001.

[0179] In such a mounted-board producing apparatus 1101, when mountedboards are produced, a plurality of boards on which electroniccomponents are to be mounted are successively carried inside therespective unit apparatuses 1001 by the carrier line 1140, predeterminedworks are performed for the respective boards in the respective unitapparatuses 1001, and thus a plurality of mounted boards are produced.

[0180] Furthermore, as shown in FIG. 13, each of the unit apparatuses1001 is formed so as to have a width which is an integer number of timesof the width W as one example of the basic dimension along the boardcarrier line 1140 or a width which is 2 or greater integer number oftimes of the width W. The printer 1110 and the electronic componentplacing apparatuses 1120, 1121, and 1122 are formed with the width 2W(corresponding to the width AW in the first embodiment), and the reflowapparatus 1130 is formed with a width which is 2 or greater integernumber of times of the width W, for example, with a width 4W, which is 4times of the width. Furthermore, the electronic component placingapparatuses 1120, 1121, and 1122 out of the respective unit apparatuses1001 are examples of a first unit apparatus 1001 a, an the reflowapparatus 1130 is one example of a second unit apparatus 1001 b.Furthermore, each of the unit apparatus 1001 is formed in the samelength L in the direction perpendicular to the width.

[0181] The reflow apparatus 1130 is formed with the width 4W. However,since, generally in a reflow apparatus, heat matching the solder reflowprofile needs to be applied to a board being carried, time for carryingthe board, that is, a board carrying distance needs to be secured, andthus a width wider than the other unit apparatuses 1001 is required.Instead of forming the reflow apparatus 1130 with the aforementionedwidth 4W, two reflow apparatuses each with a width 2W may be installedsuccessively. Furthermore, the basic dimension is a dimension defined bythe minimum width required in a work unit that is installed on the boardcarrier line of the mounted-board producing apparatus and can perform apredetermined work for the board, for example, the minimum widthrequired by the electronic component placing apparatus. For example,this is a dimension determined in a design stage.

[0182] A fixing mechanism and a moving mechanism of a unit apparatus formovably fixing and positioning each of the unit apparatuses 1001 alongthe carrier line 1140 are explained below.

[0183] The unit apparatus 1001 is equipped with fixing units 1010 as oneexample of fixing mechanisms and moving units 1020 as one example ofmoving mechanisms on the lower surface of a machine base in the unitapparatus 1001. Explanatory views showing schematic structures of thesefixing unit 1010 and moving unit 1020 are shown in FIGS. 14A and 14B.

[0184] In FIG. 14A, the fixing unit 1010 includes, for example, aircylinders 1011, as one example of a pillar elevation mechanism, fixed atfour corners of a frame under the machine base of the unit apparatus1001 formed with a rectangular frame, round bar-like support legs 1012each attached to each air cylinder 1011 so as to be lowered from orraised to the frame under the machine base which serves as one exampleof pillars, and disc-like leg receiving portions 1013, as one example ofpillar receiving portions, each of which has on the top surface thereofa depressed portion 1013 a that can be engaged with each of ends at thelower portions of the support legs 1012 and is installed on the floor1005 as one example of an installation surface of the unit apparatus1001.

[0185] The support leg 1012 has a tapered portion 1012 a having aconical shape downwards at its lower end. The inside of the depressedportion 1013 a of the leg receiving portion 1013 is in a similar mortarshape so as to be engaged with the tapered portion 1012 a. Furthermore,the lower surface of the leg receiving portion 1013 is formed so as toreceive frictional resistance between this surface and the upper surfaceof the floor 1005 and hardly slip on the floor.

[0186] In FIG. 14A, the moving unit 1020 is equipped with casters 1021fixed at the four corners of the frame under the machine base as oneexample of wheels.

[0187] Fixing and moving operations of the unit apparatus 1001 by suchfixing units 1010 and such moving units 1020 are explained below.

[0188] First, as shown in FIG. 14A, when support legs 1012 aresimultaneously raised by four air cylinders 1011, the tapered portion1012 a of each support leg 1012 becomes distant from the depressedportion 1013 a of each leg receiving portion 1013, and the unitapparatus 1001 is supported by the four casters 1021. Consequently, theunit apparatus 1001 can be moved by the casters 1021.

[0189] Subsequently, as shown in FIG. 14B, when the support legs 1012are simultaneously lowered by the air cylinders 1011, the taperedportion 1012 a of each support leg 1012 is engaged with the depressedportion 1013 a of each leg receiving portion 1013. When the support legs1012 are further lowered by the air cylinders 1011 simultaneously, thesupport legs 1012 are extended to predetermined lowering fixationpositions, and the casters 1021 supporting the unit apparatus 1001 aresimultaneously lifted from the floor 1005. Consequently, the unitapparatus 1001 is fixed by the fixing units 1010.

[0190] At this time, even when a load is applied to the unit apparatus1001 in the lateral direction, the self-weight of the unit apparatus1001 is added to the leg receiving portions 1013. Therefore, sincefrictional resistance between the lower surface of the leg receivingportions 1013 and the floor surface becomes high, and the leg receivingportions 1013 hardly move on the floor, the unit apparatus 1001 isstabilized and fixed.

[0191] Furthermore, the support leg 1012 is equipped with the taperedportion 1012 a having a conical shape pointing downwards at the lowerend portion, and the inside of the depressed portion 1013 a of the legreceiving portion 1013 is mortar-shaped. Therefore, even in the casewhere the positions of the tapered portions 1012 a of the support legs1012 are positioned off the positions of the depressed portions 1013 aof the leg receiving portions 1013 when the unit apparatus 1001 is fixedby the fixing units 1010, some displacement is corrected due to theseshapes and hence the tapered portions 1012 a of the support legs 1012can be smoothly engaged with the depressed portions 1013 a of the legreceiving portions 1013.

[0192] The case where the air cylinders 1011 of the fixing units 1010and the casters 1021 of the moving units 1020 are equipped at the fourcorners of the frame on the lower surface of the machine base of theunit apparatus 1001 has been explained, but the installation sites andthe numbers of the air cylinders 1011 and the casters 1021 are notlimited so long as these are equipped on the frame in good balance.

[0193] Schematic explanatory view showing procedures of moving andfixing operations of the unit apparatus 1001 in the mounted-boardproducing apparatus 1101 including a plurality of such unit apparatuses1001 are show in FIGS. 15-15C.

[0194] In FIG. 15A, a plurality of unit apparatuses 1001 each formedwith a width 2W are arranged so that unit apparatuses 1001-1 and 1001-2are positioned adjacent to each other and that unit apparatuses 1001-4and 1001-5 are positioned adjacent to each other in this order from theright side of the figure, and are fixed by the fixing units 1010 on thefloor surface. A space of a width 2W is provided between the unitapparatuses 1001-2 and 1001-4. Four leg receiving portions 1013 arepositioned and arranged on the floor surface in this space so that theunit apparatus 1001-3 can be installed.

[0195] Subsequently, as shown in FIG. 15B, the unit apparatus 1001-3 ismoved by the casters 1021 of the moving units 1020 into a space havingthe width 2W, the unit apparatus 1001-3 is minutely moved by the casters1021 so that the tapered portions 1012 a of the support legs 1012 of thefour fixing units 1010 of the unit apparatus 1001-3 are engaged with thedepressed portions 1013 a of the leg receiving portions 1013, which arepositioned and disposed, and the tapered portion 1012 a of each supportleg 1012 and the depressed portion 1013 a of each leg receiving portion1013 are aligned.

[0196] Subsequently, in the respective fixing unit 1010, the supportlegs 1012 are simultaneously lowered by the four air cylinders 1011 andeach tapered portion 1012 a is engaged with the depressed portion 1013 aof each leg receiving portion 1013, and the casters 1021 are lifted fromthe floor 1005 by further lowering the support legs 1012 to theaforementioned lowering fixation positions as shown in FIG. 15C, so thatthe unit apparatus 1001-3 is supported by the support legs 1012 andfixed on the floor 1005.

[0197] Consequently, the unit apparatuses 1001-1 to 1001-5 arepositioned adjacent to each other and fixed, the carrying device of theunit apparatuses 1001 are positioned at the same height, and thus themounted-board producing apparatus in which a single carrier line isformed is constituted.

[0198] In each unit apparatus 1001, the aforementioned lowering fixationposition of each support leg 1012 is adjusted and set beforehand so thatthe carrying devices have the same height in all the unit apparatuses1001 when the support legs 1012 are lowered to the aforementionedlowering fixation positions by the air cylinders 1011.

[0199] In the mounted-board producing apparatus constituted by the unitapparatuses 1001, as described above, change in arrangement of the unitapparatuses 1001 or addition or replacement of a unit apparatus can beperformed by combining the moving operation by the moving units 1020 andthe fixing operation by the fixing units 1010, respectively, of eachunit apparatus 1001.

[0200] An effect in the case where each of the unit apparatuses 1001constituting the mounted-board producing apparatus as described above isequipped with a first unit apparatus 1001 a having a width which is aninteger number of times of the aforementioned width W of the basicdimension and a second unit apparatus 1001 b having a width which is 2or greater integer number of times (integral multiple of 2 or greater)of the aforementioned width W of the basic dimension, so that change ofthe types of the unit apparatuses 1001 and change in arrangement thereofare performed in the mounted-board producing apparatus is explainedbelow with reference to the following specific example.

[0201] FIGS. 16A-16E are explanatory views schematically showingarrangement of the unit apparatuses in the mounted-board producingapparatus. First, in FIG. 16A, the mounted-board producing apparatus1101 a includes a printer 1003-1 having a width W, a chip componentplacing apparatus 1001 a-1 having a width 2W as one example of anelectronic component placing apparatus, a chip component placingapparatus 1001 a-2 having the width 2W, and a reflow apparatus 1001 b-1having a width 4W, in this order from the right side to the left side ofthe figure. The total length of the mounted-board producing apparatus1101 a in the width direction is 9W.

[0202] In a mounted-board producing apparatus 1101 a having such aconstitution, when the type of the unit apparatus 1001 is changed alongwith change of the types of electronic components to be mounted, changeof the types of boards to be produced, or the like, a mounted-boardproducing apparatus 1101 b having the same total length as the totallength 9W of the mounted-board producing apparatus 1101 a can beconstituted without changing the arrangement of the printer 1003-1 andthe chip component placing apparatus 1001 a-1, of which types are notchanged, as shown in FIG. 16B, by replacing the chip component placingapparatus 1001 a-2 having the width 2W by an IC placing apparatus 1001a-3 having a width 3W as one example of an electronic component placingapparatus and by replacing the reflow apparatus 1001 b-1 having thewidth 4W by a reflow apparatus 1001 b-2 having a width 3W.

[0203] Furthermore, in the mounted-board producing apparatus 1101 a, asanother example of the case where the types are changed as describedabove, a mounted-board producing apparatus 1101 c having the same totallength as the total length 9W of the mounted-board producing apparatus1101 a can be constituted without changing the printer 1003-1 and thechip component placing apparatus 1001 a-2, of which types are notchanged, by replacing the chip component placing apparatus 1001 a-1having the width 2W by a chip component placing apparatus 1001 a-4having a width W and a chip component placing apparatus 1001 a-5 havinga width W, and by replacing the reflow apparatus 1001 b-1 having thewidth 4 W by the reflow apparatus 1001 b-3 having a width 2W and areflow apparatus 1001 b-4 having a width 2W, as shown in FIG. 16C.

[0204] Furthermore, as shown in FIG. 16D, a mounted-board producingapparatus 1101 d includes a printer 1003-11 having a width 2W, a chipcomponent placing apparatus 1001 a-11 having a width 2W, a chipcomponent placing apparatus 1001 a-12 having a width 2W, and a reflowapparatus 1001 b-11 having a width 2W from the right side to the leftside in this order in the figure. In the mounted-board producingapparatus 1101 d, all the unit apparatuses 1001 are constituted with thewidth 2W.

[0205] In such a mounted-board producing apparatus 1101 d, for example,when only a chip component placing apparatus 1001 a-12 is replaced by anIC placing apparatus of a different type, by using an IC placingapparatus 1001 a-13 constituted with the same width 2W as that of thechip component placing apparatus 1001 a-12 as the IC placing apparatus,the IC placing apparatus 1001 a-13 can be installed without moving theunit apparatuses 1001 other than the chip component placing apparatus1001 a-12 in the mounted-board producing apparatus 1101 d as shown inFIG. 16E to constitute a mounted-board producing apparatus 1101 e.

[0206] Furthermore, as shown in FIGS. 16A to 16C, when the leg receivingportions 1013 of the fixing units 1010 of each unit apparatus 1001 arepreset with a pitch of a basic dimension W, which is the minimum unit ofthe width of the unit apparatus 1001, on the floor surface on which themounted-board producing apparatus is to be installed, the unit apparatusinstallation position can be easily determined when a position changework, replacement work, or the like of a unit apparatus is performed inthe mounted-board producing apparatus.

[0207] According to the second embodiment, each of the unit apparatuses1001 constituting the mounted-board producing apparatus is not formedwith each individual width unlike each work apparatus in a conventionalapparatus, but formed with a width which is an integer number of timesof the width W as one example of the basic dimension or with a widthwhich is 2 or greater integer number of times of the width W. Therefore,for example, when one or a plurality of unit apparatuses 1001 arereplaced among a plurality of arranged unit apparatuses 1001, the one orplurality of unit apparatuses 1001 are moved, and then, in a space ofthe positions at which the one or plurality of unit apparatuses 1001 arearranged before, one or a plurality of new unit apparatuses 1001 ofwhich total length is constituted by the width of the space, that is, awidth an integer number of times of the width W can be arranged.Therefore, in a position change, replacement work, or the like of one ora plurality of unit apparatuses in the mounted-board producingapparatus, there can be no or little influence on positions of unitapparatuses that are not subjected to a position change work,replacement, or the like, and thus a mounted-board producing apparatusin which the position change, replacement work, or the like of unitapparatuses can be easily performed can be provided.

[0208] Furthermore, there can be provided a mounted-board producingapparatus in which, by including fixing units and moving units formovable fixing and positioning each unit apparatus in each unitapparatus constituting the mounted-board producing apparatus, fixingwork and moving work of the unit apparatus formed with a width aninteger number of times of the aforementioned certain width W or a widthof an integer number which is 2 or greater of times of the certain widthW can be easily performed, and a position change work or the like of theunit apparatus can be easily performed.

[0209] Furthermore, by including air cylinders 1011 in the fixing units1010 of the unit apparatus 1001 as a mechanism for raising and loweringsupport legs 1012 that can support and fix the unit apparatus 1001, theair cylinders 1011 are simultaneously operated, and hence simultaneousraising or lowering operations of the support legs 1012 can be easilyperformed. Therefore, there can be provided a mounted-board producingapparatus in which fixing and moving operations of the unit apparatus1001 can be easily and stably performed and a position change work orthe like of the unit apparatus can be easily and smoothly performed.

[0210] Furthermore, when the leg receiving portions 1013 of the fixingunits 1010 of each unit apparatus 1001 are preset with a pitch of thebasic dimension W, which is the minimum unit of the width of the unitapparatus 1001, on the floor surface, on which the mounted-boardproducing apparatus is to be installed, the installation position of theunit apparatus 1001 can be easily determined when a position changework, replacement work, or the like of a unit apparatus is performed inthe mounted-board producing apparatus.

[0211] The scope of the present invention is not limited to the aboveembodiment and can be applied in other various aspects. For example,unit apparatuses 1050 constituting a mounted-board producing apparatusaccording to a third embodiment of the present invention include afixing unit 1060 having a different structure from that of the fixingunit 1010 in the unit apparatus 1001 constituting the mounted-boardproducing apparatus in the second embodiment, and other components arethe same as those of the unit apparatus 1001. Therefore, only thisdifferent fixing unit 1060 is explained below.

[0212]FIGS. 17A and 17B are explanatory views showing respectivestructures of fixing units 1060 as one example of fixing mechanisms andmoving units 1020 as one example of moving mechanisms, which areprovided to the lower surfaced of the machine base of the unit apparatus1050.

[0213] In FIG. 17A, the fixing units 1060 each include, for example, anut 1061 fixed at each of four corners of a frame formed with a frame ina rectangular shape under the machine base of the unit apparatus as oneexample of a pillar elevation mechanism, a screw shaft 1062 engaged withand attached to each nut 1061 so as to be vertically movable downwardsfrom the frame under the machine base as one example of a pillar, and adisc-like bearing board 1063 attached to a lower end portion of thescrew shaft 1062 as one example of a pillar receiving portion. The lowersurfaces of the bearing boards 1063 are formed so as to receivefrictional resistance between these surfaces and the upper surface ofthe floor 1005 as one example of an installation surface of the unitapparatus 1050 and hardly slip on the floor surface.

[0214] In FIG. 17A, the moving units 1020 are the same as the movingunits 1020 of the second embodiment and include casters 1021 fixed atfour corners of the frame under the machine base as one example ofwheels.

[0215] Fixing and moving operations of the unit apparatus 1005 by suchfixing units 1060 and moving units 1020 are explained below.

[0216] First, as shown in FIG. 17A, since the screw shafts 1062respectively engaged with the four nuts 1061 are simultaneously rotatedrelatively to the nuts 1061, the screw shafts 1062 are simultaneouslyraised between the nuts 1061 and the floor 1005, the bearing boards 1063attached to the end portions of the screw shafts 1062 become distantfrom the floor 1005, and the unit apparatus 1050 is supported by thefour casters 1021. Consequently, the unit apparatus 1050 can be moved bythe casters 1021.

[0217] Subsequently, as shown in FIG. 17B, since the screw shafts 1062respectively engaged with the four nuts 1061 are simultaneously rotatedrelatively to the nuts 1061, the screw shafts 1062 are simultaneouslylowered between the nuts 1061 and the floor 1005, the bearing boards1063 attached to the end portions of the screw shafts 1062 is broughtinto contact with the upper surface of the floor 1005, the screw shafts1062 are simultaneously lowered between the nuts 1061 and the floor 1005by further rotating the screw shafts 1062 relatively and simultaneouslyto the nuts 1061, and the unit apparatus 1050 is fixed by the fixingunits 1060 by lifting the casters 1021 supporting the unit apparatus1050 from the upper surface of the floor 1005.

[0218] At this time, even when a load is applied to the unit apparatus1050 in the lateral direction, a self-weight of the unit apparatus 1005is applied to the bearing boards 1063. Therefore, since frictionalresistance between the lower surface of the bearing board 1063 and thefloor surface is increased and the bearing board 1063 hardly moves onthe floor surface, the unit apparatus 1050 is stably fixed.

[0219] Since procedures of the moving and fixing operations of the unitapparatus 1050 in such a mounted-board producing apparatus including aplurality of unit apparatuses 1050 are the same as in the secondembodiment, the explanation thereof is omitted.

[0220] In order to make the carrying devices of the unit apparatuses1050 in the same height when the unit apparatuses 1050 are seriallydisposed and fixed, each screw shaft 1062 is rotated relatively to eachnut 1061 in the fixing units 1060 of each unit apparatus 1050 to adjustthe height of the carrying device.

[0221] Furthermore, in the fixing unit 1060, instead of attaching thebearing board 1063 to the end portion of the screw shaft 1062, thebearing board 1063 may be installed on the floor 1005 and include adepressed portion that can be engaged with the lower end portion of thescrew shaft 1062, on the upper surface thereof as in the case of the legreceiving portion 1013 of the second embodiment.

[0222] According to the third embodiment, as in the case of the effectof the second embodiment, each of the unit apparatuses 1001 constitutingthe mounted-board producing apparatus is not formed with each individualwidth unlike each work apparatus in a conventional apparatus, but formedwith a width which is an integer number of times of the width W as oneexample of the basic dimension or with a width which is 2 or greaterinteger number of times the width W. Therefore, for example, when one ora plurality of unit apparatuses 1001 are replaced among a plurality ofarranged unit apparatuses 1001, the one or plurality of unit apparatuses1001 are moved, and then, in a space of the position at which the one orplurality of unit apparatuses 1001 are arranged before, one or aplurality of new unit apparatuses 1001 of which total width is the widthof the space, that is, a width which is an integer number of times ofthe width W can be arranged. Therefore, in a position change,replacement work, or the like of one or a plurality of unit apparatusesin the mounted-board producing apparatus, there can be no or littleinfluence on positions of the unit apparatuses that are not subjected toa position change work, replacement, or the like, and thus amounted-board producing apparatus in which the position change,replacement work or the like of unit apparatuses can be easily performedcan be provided.

[0223] Furthermore, there can be provided a mounted-board producingapparatus in which, by including fixing units and moving units formovable fixing and positioning the unit apparatus in each of the unitapparatuses constituting the mounted-board producing apparatus, fixingand moving works of a unit apparatus formed with a width which is aninteger number of times of the aforementioned basic dimension W and awidth which is 2 or greater integer number of times of the width W canbe easily performed and position change works or the like of the unitapparatus can be easily performed.

[0224] In addition, the air cylinders are not used in the fixing unitsunlike in the second embodiment, but the screw shafts can be raised orlowered by reciprocally (forwardly and reversely) rotating the screwshafts relatively to the nuts by using a simple mechanism of the nutsand the screw shafts. Therefore, manufacturing costs of the unitapparatus can be reduced.

[0225] According to the 13th aspect of the present invention, since eachof the unit apparatuses constituting the mounted-board producingapparatus is not formed with each individual width unlike each workapparatus in a conventional apparatus, but the mounted-board producingapparatus includes the first unit apparatus having a dimension of aninteger number of times of the basic dimension along the board carryingdirection and a second unit apparatus having a dimension which is 2 orgreater integer number of times of the basic dimension as the unitapparatuses. Therefore, for example, when one or a plurality of unitapparatuses 1001 are replaced among a plurality of arranged unitapparatuses 1001, the one or plurality of unit apparatuses 1001 aremoved, and then, in a space of the position at which the one orplurality of unit apparatuses 1001 are arranged, one or a plurality ofnew unit apparatuses 1001 of which total width dimension is thedimension of the space in the carrying direction, that is, a width aninteger number of times of the basis dimension can be arranged.Therefore, in a position change, replacement work, or the like of theone or a plurality of unit apparatuses in the mounted-board producingapparatus, there can be no or little influence on positions of the unitapparatuses that are not subjected to the position change work,replacement, or the like, and thus a mounted-board producing apparatusin which a position change, replacement work, or the like of the unitapparatus can be easily performed can be provided.

[0226] Furthermore, according to the 14th aspect or the 15th aspect ofthe present invention, in addition to the effect of the first aspect,there can be provided a mounted-board producing apparatus in which, byincluding a fixing mechanism and a moving mechanism for movably fixingand positioning the unit apparatus in each of the unit apparatusesconstituting the mounted-board producing apparatus, the fixing andmoving works of the unit apparatus formed with a width an integer numberof times of the aforementioned basic dimension and a width which is 2 orgreater integer number of times of the basic dimension can be easilyperformed and a position change work or the like of the unit apparatuscan be easily performed.

[0227] According to the 16th aspect of the present invention, byincluding the cylinders in the fixing mechanism of the unit apparatus asa pillar projection-and-retreat mechanism for raising or lowering thepillars that can support and fix the unit apparatus, the cylinders aresimultaneously operated, and hence simultaneous raising or loweringoperations of the respective pillars can be easily performed. Therefore,there can be provided a mounted-board producing apparatus in whichfixing and moving operations of the unit apparatus can be easily andstably performed and a position change work or the like of the unitapparatus can be easily and smoothly performed.

[0228] According to the 17th aspect of the present invention, by using asimple mechanism of nuts and screw shafts as the fixing mechanism of theunit apparatus, manufacturing costs of the unit apparatus can bereduced, and thus a mounted-board producing apparatus in which aposition change work or the like of the unit apparatus can be easilyperformed can be provided at low costs.

[0229] According to the 18th aspect of the present invention, byincluding the pillar receiving portions each having the depressedportion that can be engaged with the end portion of each pillarprojected and retreated by each pillar projection-and-retreat mechanismin the fixing mechanism of the unit apparatus, the respective pillarreceiving portions can be preset on the installation surface at aposition at which the unit apparatus is fixed when moving and fixingoperations of the unit apparatus are performed, and the position atwhich the unit apparatus is fixed can be easily determined. Thus therecan be provided a mounted-board producing apparatus in which the unitapparatus can be fixed without damaging the installation surface by theend portion of each pillar supporting and fixing the unit apparatus anda position change work or the like of the unit apparatus can be easilyperformed.

[0230] According to the 19th aspect of the present invention, since theelectronic component placing apparatus for a mounted-board producingapparatus used in the mounted-board producing apparatus includes thefixing mechanism and the moving mechanism which movably fix and positionthe electronic component placing apparatus, fixing and moving works ofthe electronic component placing apparatus can be easily performed, andthere can be provided an electronic component placing apparatus for amounted-board producing apparatus in which a position change work or thelike of the electronic component placing apparatus can be easilyperformed.

[0231] Fourth to Sixth Embodiments

[0232] The fourth to sixth embodiments of the present invention relateto the structures of the electronic component placing apparatusesaccording to the first to third embodiments, which places electroniccomponents 99 on a circuit board 8.

[0233] In recent years, high-speed and precise mounting of electroniccomponents has been required in electronic component mounting.

[0234] A conventional electronic component placing apparatus isexplained below with reference to FIG. 19. FIG. 19 is a generalschematic view showing an electronic component placing apparatus. InFIG. 19, reference numeral 801 denotes a carrying unit for carrying inand out an electronic circuit board 8. Reference numeral 803 denotes anX-axis ball screw shaft. Reference numeral 804 denotes a Y-axis ballscrew shaft. This apparatus is constituted such that nozzles 807 forsucking and placing electronic components 99 from a component feedingunit 805 and a board recognition camera 810 for measuring a position ofboard marks 808 provided on the electronic circuit board 8 arepositioned to arbitrary positions above the electronic circuit board 8by an X-Y robot constituted by these one X-axis shafts and two Y-axisshafts. Furthermore, reference numeral 811 denotes a componentrecognition camera for measuring suction attitudes of the electroniccomponents 99.

[0235] Operations of the electronic component placing apparatusconstituted as above are explained below. First, the electronic circuitboard 8 is carried in to a predetermined position by the carrying unit801. The X-Y robot moves the board recognition camera 810 provided atthe head 809 to above the board marks 808 provided on the electroniccircuit board 8. Here, the board recognition camera 810 measures theposition of the electronic circuit board 8, and correcting of positionsat which the electronic components 99 are to be placed is performed.Subsequently, the X-Y robot moves to above the feeding unit 805, lowersthe nozzles 807 and suck the electronic components 99, thereafter movesto above the component recognition camera 811, picks up images of thesuction attitudes of the electronic components 99, and performscorrection, and then the electronic components 99 are placed onto theelectronic circuit board 8.

[0236] However, the electronic component placing apparatus having theabove constitution has the following issues.

[0237] First, as described above and shown in FIG. 20, the X-Y robottype component placing apparatus is constituted by the one X-axis ballscrew shaft 803 and the two Y-axis ball screw shafts 804 disposed underboth sides thereof, which is an equipment structure that the equipmentframe is made larger since the two Y-axis ball screw shafts 804 move theX-axis ball screw shaft 803. Furthermore, a space for installing a motoris required in the X-axis ball screw shaft 803, which is also a cause tomake the equipment frame larger.

[0238] Furthermore, in the X-Y robot type component placing apparatusshown in FIG. 22, in a head 809 having a plurality of nozzles 807arranged in one line or a plurality of lines in the X direction, theboard recognition camera 810 is installed on an extension of the nozzleline in the X direction, and there is an issue that strokes forattaching and sucking the electronic component 99 in the X direction aresmall.

[0239] An object of the fourth to sixth embodiments of the presentinvention is to provide an electronic component placing apparatus withwhich area productivity can be improved, and thus the aforementionedconventional issues can be solved.

[0240] FIGS. 19-26 show the embodiments of the present invention.

[0241] The fourth embodiment of the present invention is explained belowwith reference to the drawings.

[0242] FIGS. 21-24 show the fourth embodiment of the present invention,and are structural views showing an X-Y robot for moving a head unit 709to an arbitrary position. As shown in FIGS. 21-24, the X-Y robot formoving the head unit 709 having a placement unit having a plurality ofnozzles 707 for sucking and placing a plurality of electronic components99 and a board recognition camera 710 as one example of a recognitionunit to arbitrary positions is constituted by a Y-axis ball screw shaft704 and an X-axis linear motor 712. This X-Y robot is disposed as aceiling suspended type, which is suspended from an apparatus ceiling770. Specifically, one Y-axis ball screw shaft 704 is suspended from theapparatus ceiling 770, and one X-axis linear motor 712 is similarlydisposed below the Y-axis ball screw shaft 704.

[0243] Operations of the electronic component placing apparatusaccording to the fourth embodiment having the above constitution areexplained with reference to FIGS. 21-24.

[0244] The X-Y robot constituted as described above can move in the Xdirection and the Y direction. As to the Y direction, the X-Y robot canmove to the penetrating front and rear sides of the drawing sheet by theY-axis ball screw shaft 704 as one example of a Y-axis direction movingapparatus. Furthermore, as to the X direction, the X-Y robot can move inthe left and right direction of the drawing sheet by the X-axis linearmotor 712 provided below one suspended Y-axis ball screw shaft 704 asone example of an X-axis direction moving apparatus. The whole robot canmove to a target arbitrary position since the X-axis linear motor 712and the Y-axis ball screw shaft 704 move independently to arbitrarypositions.

[0245] Differences between the electronic component placing apparatusaccording to the fourth embodiment of the present invention and aconventional electronic component placing apparatus are explained belowwith reference to FIG. 20 and FIGS. 21-24. FIG. 20 is a structural viewshowing a conventional X-Y robot. As shown in FIG. 20, the conventionalX-Y robot is constituted by one X-axis ball screw shaft 803 and twoY-axis ball screw shafts 804 provided perpendicular to the X-axis ballscrew shaft 803 and under the both sides thereof. There is a mechanismfor movement in the Y direction, the X-axis ball screw shaft 803 moveson the two Y-axis ball screw shafts 804 provided on the left and rightsides so that a head 809 that has nozzles 807 and a board recognitioncamera 810 and that is attached to the X-axis ball screw shaft is movedto a position at which placement is to be performed on an electroniccircuit board 8. On the other hand, the fourth embodiment of the presentinvention is characterized by the constitution and operations shown inFIGS. 21-24 and described as above. When FIG. 20 and FIGS. 21-24 arecompared, the whole X-Y robot requires a facility width of c+2b in theconventional constitution, while the fourth embodiment of the presentinvention can be constituted with only a facility width of c since noY-axis ball screw shaft is provided on both sides.

[0246] As described above, according to the fourth embodiment, since theX-Y robot as constitution thereof includes the one Y-axis directionmoving apparatus as the ceiling suspended type, and the X-axis directionmoving apparatus is suspended therebelow, the equipment frame width canbe reduced in comparison with the conventional apparatus.

[0247] Furthermore, according to the fourth embodiment, by including alinear motor as the X-axis direction moving apparatus, a space for amotor unit due to a conventional ball screw shaft can be eliminated,and, as a result, the equipment frame width can be reduced in comparisonwith the conventional apparatus. Furthermore, since the equipment widthis reduced and a small size board is used, in the ceiling suspended typeX-Y robot using the linear motor as the X-axis direction movingapparatus, bending in the vicinity of the center in the X-axis directioncan be reduced, and hence the placement precision can be furtherimproved. That is, by disposing the Y-axis direction moving apparatusalmost immediately above a component placement position at whichelectronic components are placed on a board, bending in the vicinity ofthe center in the X-axis direction can be reduced, and precision inplacement of the electronic components can be improved. Conventionally,since two Y-axis direction moving apparatuses are provided on both sidesof the component placing apparatus and one X-axis direction movingapparatus is disposed thereon, the X-axis robot is bent at a position atwhich a work is actually being performed, and hence placement of microcomponents is difficult. On the other hand, in the fourth embodiment,micro components can be placed in high precision as described above.

[0248] Furthermore, in the fourth embodiment, the board recognitioncamera 710 as one example of a recognition unit is disposed at aposition different from in the conventional apparatus.

[0249] That is, in addition to FIGS. 21-24, FIG. 26 is a structural viewshowing a head unit 709 in the above electronic component placingapparatus and a schematic view showing two head units 709 included inthe equipment viewed from below. Reference numeral 707 denotes a nozzlefor sucking and placing an electronic component 99. Reference numeral710 denotes a board recognition camera for picking up images of boardmarks (for example, the conventional board marks 808 in FIG. 19)provided on an electronic circuit board 8. As shown in FIG. 26, the headunit is equipped therein with the board recognition camera 710 in frontof a plurality of, the nozzles 707 arranged in two lines in the Xdirection.

[0250] Operations of the electronic component placing apparatus of thefourth embodiment having the above constitution are explained below withreference to FIGS. 21-24 and FIG. 26.

[0251] After an electronic circuit board 8 is carried into theequipment, the head unit 709 is moved, for example, downwards in FIG. 26to above the board marks provided on the electronic circuit board 8 bythe X-Y robot, images of the board marks is picked up by the boardrecognition camera 710 of the head unit 709, and correction is made forplacement to an arbitrary position on the electronic circuit board 8.Furthermore, the head unit 709 is moved upwards in FIG. 26 by the X-Yrobot and sucks a component 99 from a component feeding cassette 5 inFIG. 3 so that placement to an arbitrary position on the electroniccircuit board 8 can be performed.

[0252] Differences between the electronic component placing apparatusaccording to the fourth embodiment of the present invention and aconventional electronic component placing apparatus are explained belowwith reference to FIGS. 25 and 26. FIG. 25 is a structural view showingthe inside of a conventional head unit. As shown in FIG. 25, theconventional head unit includes therein a board recognition camera 810on an extension of a plurality of nozzles 807 arranged in two lines inthe X direction, and a stroke a when the electronic components aresucked and placed is small with respect to a width B between both endsof the two head units 809 disposed in the equipment. On the other hand,in the electronic component placing apparatus according to the fourthembodiment of the present invention, since the component recognitioncamera 810 is disposed in front of a plurality of nozzles 807 arrangedin two lines in the X direction as shown in FIG. 26 and described asabove, a sucking and placing stroke A can be made large with respect tothe same width B between the both ends of the two head units.

[0253] As a working example, when the stroke (distance between centersof the head units) a is 240 mm and the width B between the both ends ofthe two head units is 450 mm, a sucking stroke A can be moved by 150 mmeach towards both sides with respect to the center and the total suckingstroke A becomes 300 mm in the fourth embodiment. On the other hand, inthe conventional apparatus, the conventional sucking stroke cannot bemoved by the width of the camera at the right end of FIG. 25, which is60 mm, and becomes 300 mm−60 mm=240 mm. Therefore, from (sucking strokeof fourth embodiment/conventional sucking stroke)×100=(300/240)>100=125,the sucking stroke can be increased by 25%.

[0254] As described above, according to the fourth embodiment, since thehead unit is equipped with a board recognition camera in front of thenozzles as the constitution of the head unit, the sucking and placingstroke in the nozzle arrangement direction, that is, the X direction canbe increased in comparison to the conventional apparatus.

[0255] As described above, according to the present invention, in theelectronic component placing apparatus, first, since the X-Y robot isconstituted such that the Y-axis direction moving apparatus is disposedas a ceiling suspended type and that the X-axis direction movingapparatus is suspended therebelow, the equipment frame width can bereduced.

[0256] Furthermore, since a linear motor is adopted as the X-axisdirection moving apparatus, a space for a motor unit due to adoption ofa ball screw shaft in the conventional constitution can be eliminated,and hence the equipment frame width can be reduced.

[0257] Furthermore, in the head unit drive apparatus having nozzles andan optical image pickup apparatus as the recognition unit for picking upthe images of the board marks provided on electronic circuit board,since the optical image pickup apparatus is disposed between both endsin the X direction of a plurality of nozzles arranged in one line or aplurality of lines in the X-axis direction and in front or rear in theY-axis direction, the stroke for sucking and placing electroniccomponents can be increased.

[0258] Therefore, by the fourth embodiment, area productivity in theelectronic component placing apparatus can be improved. That is, areaproductivity can be improved due to reduction of the equipment framewidth and increase of the stroke for sucking and placing electroniccomponents.

[0259] By appropriately combining arbitrary embodiments out of the abovevarious embodiments, effects of the respective embodiments can bedemonstrated.

[0260] Although the present invention has been fully described inconnection with the preferred embodiments thereof with reference to theaccompanying drawings, it is to be noted that various changes andmodifications are apparent to those skilled in the art. Such changes andmodifications are to be understood as included within the scope of thepresent invention as defined by the appended claims unless they departtherefrom.

What is claimed is:
 1. An electronic component placing apparatus forplacing electronic components (99) on a board (8) having a length Lalong a board carrying direction, the electronic component placingapparatus comprising: an electronic component feeding unit (5) forfeeding the electronic components; a carrying unit (77, 78) that cancarry the board in the carrying direction from a board retreat position(P1, P3) to a component placement position (P2), further from thecomponent placement position to an outside of the component placementposition; a plurality of head units (41) for holding the components fromthe electronic component feeding unit and then placing the heldcomponents on a plurality of boards; and a drive unit (42,43) for movingthe plurality of head units between the electronic component feedingunit and the boards, wherein a substantial apparatus width along theboard carrying direction is a total dimension 4L+SL of 4L as a lengthwith which each of two boards corresponding to the plurality of headunits can be positioned at each component placement position and a boardretreat position corresponding to each placement position can be securedand SL as a space for positioning a board stop mechanism at eachplacement position and each board retreat position, which is between 450mm and 1000 mm inclusive.
 2. The electronic component placing apparatusaccording to claim 1, wherein the substantial apparatus width (W) is notless than 540 mm and not more than 660 mm.
 3. The electronic componentplacing apparatus according to claim 2, wherein a number of the headunits is
 2. 4. The electronic component placing apparatus according toclaim 3, wherein a length L of the carried board along the carryingdirection is shorter than 250 mm.
 5. The electronic component placingapparatus according to claim 1, wherein moving ranges (83) of theplurality of head units are independent of each other.
 6. The electroniccomponent placing apparatus according to claim 1, wherein the drive unithas at least a same number of drive mechanisms (42,43) capable of movingthe head units in two directions perpendicular to each other as that ofthe plurality of head units.
 7. The electronic component placingapparatus according to claim 1, further comprising a cover (31) forhousing the plurality of head units and the drive unit, wherein thesubstantial apparatus width is defined by the cover.
 8. A mounted-boardproducing apparatus comprising the plurality of electronic componentplacing apparatuses according to claim 1, wherein a board width of thecarried board in the carrying direction is shorter than 250 mm; and thesubstantial apparatus width (W) of each of the plurality of electroniccomponent placing apparatuses in the carrying direction is not less than450 mm and not more than 1000 mm, and a distance (C) between theplurality of electronic component placing apparatuses is equal to theboard width or shorter in the vicinity of positions at which the boardis sent and received.
 9. The mounted-board producing apparatus accordingto claim 8, wherein each of the plurality of electronic componentplacing apparatus (21, 22) further comprises a component feeding unit(5) for feeding the electronic components to the head unit; and thecomponent feeding unit is positioned only on one side out of two sidesof the carrying path of the carrying unit.
 10. The mounted-boardproducing apparatus according to claim 8, wherein each of the pluralityof electronic component placing apparatuses further comprises a cover(31) for housing the head unit and the drive unit; and a distancebetween the plurality of electronic component placing apparatuses isdefined by the cover.
 11. The electronic component placing apparatusaccording to claim 1, which comprises: a protection cover (75) forcovering a side of the head unit; a first retreat mechanism (73) forretreating the protection cover from the head unit; a panel (33) whichis disposed between the protection cover and the head unit and has adisplay (74); and a second retreat mechanism (76) for retreating thepanel from the head unit independently of the protection cover.
 12. Theelectronic component placing apparatus according to claim 11, whereinthe first retreat mechanism is a mechanism for rotating the protectioncover about an upper end of the protection cover, and the second retreatmechanism is a mechanism for rotating the panel about an upper end ofthe panel independently of the protection cover.
 13. A mounted-boardproducing apparatus (1101) comprising placement work units (1120, 1121,1122) for placing the electronic components on the board with solderstherebetween and a reflow work unit (1130) for allowing the solders toreflow to fix the electronic components on the board to produce amounted board, to produce the mounted board from the board whilecarrying the board to the placement work unit and the reflow work unit,which comprises: a first unit apparatus (1001 a) having either one ofthe placement work unit and the reflow work unit and having a dimensionwhich is an integer number of times of a basic dimension along thecarrying direction of the board; and a second unit apparatus (1001 b)having the other one of the placement work unit and the reflow work unitand having a dimension which is an integer number which is 2 or more oftimes of the basic dimension along the carrying direction of the board,wherein the unit apparatus having the placement work unit is theelectronic component placing apparatuses according to claim 1, and thefirst unit apparatus and the second unit apparatus are disposed seriallyin the carrying direction and fixed movably.
 14. The mounted-boardproducing apparatus according to claim 13, wherein each unit apparatus(1001) of the first unit apparatus and the second unit apparatuscomprises: a fixing mechanism (1010, 1060) for fixing the unit apparatusalong the carrying direction; and a moving mechanism (1020) forreleasing fixation of the unit apparatus by the fixing mechanism andmoving the unit apparatus off the carrying direction.
 15. Themounted-board producing apparatus according to claim 14, wherein thefixing mechanism comprises: a plurality of pillar elevation mechanisms(1011, 1061) fixed under a machine base of the unit apparatus; andpillars (1012, 1062) attached to each of the pillar elevation mechanismso as to be raised from or lowered to an installation surface (1005) ofthe unit apparatus from the machine base, the moving mechanism comprisesa plurality of wheels (1021) that are fixed under the machine base ofthe unit apparatus and can movably support the unit apparatus on theinstallation surface; the unit apparatus is fixed by lowering each ofthe pillars by each of the pillar elevation mechanisms to lift eachwheel from the installation surface and then supporting the unitapparatus by each of the pillars on the installation surface; and theunit apparatus can be moved by raising each pillar of each of the pillarelevation mechanisms and then supporting the unit apparatus by each ofthe wheels on the installation surface.
 16. The mounted-board producingapparatus according to claim 15, wherein the pillar elevation mechanismcomprises a cylinder (1011), and the pillar attached to the pillarelevation mechanism is moved vertically by operating the cylinder. 17.The mounted-board producing apparatus according to claim 15, wherein thepillar is a screw shaft (1062), the pillar elevation mechanism is a nut(1061) engaged with the screw shaft, and the pillar attached to thepillar elevation mechanism is moved vertically by reciprocally rotatethe screw shaft relatively to the nut.
 18. The mounted-board producingapparatus according to claim 15, wherein the fixing mechanism furtherhas a depressed portion (1013 a) that can be engaged to an end portion(1012 a) of the pillar lowered by the pillar elevation mechanism andcomprises a pillar receiving portion (1013, 1063) set on theinstallation surface.
 19. The electronic component placing apparatus(1001, 1120, 1121, 1122) according to claim 1 for a mounted-boardproducing apparatus for producing a mounted board by placing theelectronic components on the board with solders therebetween, whichcomprises: a fixing mechanism (1010, 1060) for fixing the electroniccomponent placing apparatus; and a moving mechanism (1020) for releasingfixation of the electronic component placing apparatus by the fixingmechanism and then moving the electronic component placing apparatus,wherein the fixing mechanism comprises: a plurality of pillar elevationmechanisms (1011, 1061) fixed under a machine base of the electroniccomponent placing apparatus; and a pillar (1012, 1062) attached from themachine base to each of the pillar elevation mechanisms so as to beraised from or lowered to the installation surface (1005) of theelectronic component placing apparatus, the moving mechanism comprises aplurality of wheels (1021) that are fixed under the machine base of theelectronic component placing apparatus and can movably support theelectronic component placing apparatus on the installation surface, theelectronic component placing apparatus is fixed by lowering each pillarby the pillar elevation mechanism to lift each of the wheels from theinstallation surface and then supporting the electronic componentplacing apparatus by each of the pillars on the installation surface,and the electronic component placing apparatus can be moved by raisingeach of the pillars (1012, 1062) by each of the pillar elevationmechanisms and then supporting the electronic component placingapparatus by the respective wheels on the installation surface.
 20. Anelectronic component placing apparatus, wherein the head unit comprisesa placing unit for placing the electronic components fed from theelectronic component feeding unit on the board and a recognition unitfor recognizing this board, the electronic component placing apparatuscomprises: an X-axis direction moving apparatus (712) for moving thehead unit in an X direction, which is a direction of carrying the board;and a Y-axis direction moving apparatus (704) for moving this X-axisdirection moving apparatus in a Y direction perpendicular to the Xdirection, wherein the X-axis direction moving apparatus is disposedbelow the Y-axis direction moving apparatus and above the board.
 21. Theelectronic component placing apparatuses according to claim 20, whereinthe Y-axis direction moving apparatus is disposed almost immediatelyabove a component placement position at which the electronic componentsare placed on the board.
 22. The electronic component placingapparatuses according to claim 20, wherein the X-axis direction movingapparatus is constituted by a linear motor.
 23. The electronic componentplacing apparatuses according to claim 20, wherein the recognition unitis deviated from the placing unit in the Y direction.